Tradeshow

Intermold Osaka

AEC Tradeshow

INTERMOLD has been leading Japanese mold industry more than 35 years as only one exhibition to showcase state-of-the-art mold technology in Japan. Nowadays the manufacturing industry is required to transform the production to cope with changes in the business environment like electrification of automobiles, carbon neutral, digital manufacturing, and producing new materials. We organize special fairs on plastic parts processing, manufacturing DX, AI, and robotics to engage with key sectors such as automotive, aerospace, and electronic components closely tied to the die and mold industry.

In addition, the AM EXPO focused on Additive Manufacturing has been held concurrently with INTERMOLD since 2024, offering solutions for complex shapes, small-lot production, and weight reduction. It will also be co-located with the 2026 Nagoya.

As a specialized trade fair for die and mold, metal pressing, and parts processing, we provide this comprehensive platform which offers contacts to all the steps of manufacturing starting from Machine parts and Tooling industries.

IN-PERSON EVENT:

Intex Osaka

1-5-102, Nanko-Kita, Suminoe-ku, Osaka, 559-0034

Register Now

Tradeshow
Awareness
Production, Fabrication & Assembly
Software - Metrology & Quality Control
Manufacturing
6Probe
8-Axis
BuildIT Construction
As-Built

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